Microelectronics International

期刊简介：Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:• Advanced packaging• Ceramics• Chip attachment• Chip on board (COB)• Chip scale packaging• Flexible substrates• MEMS• Micro-circuit technology• Microelectronic materials• Multichip modules (MCMs)• Organic/polymer electronics• Printed electronics• Semiconductor technology• Solid state sensors• Thermal management• Thick/thin film technology• Wafer scale processing.

【译文】《微电子国际》提供了一个权威的、国际的和独立的论坛，用于对与先进封装、微电路工程、互连、半导体技术和系统工程相关的研发、应用、工艺和当前实践进行批判性评估和传播。它代表了一个当前、全面和实用的信息工具。编辑约翰·阿特金森博士欢迎向该期刊投稿，包括技术论文、研究论文、案例研究和综述论文。请查看作者指南以获取更多详细信息。《微电子国际》涵盖了与微型化电子设备和先进封装的设计、制造、组装和各种应用相关的关键技术及其相关问题的多学科研究。涵盖的主题范围广泛，包括：• 先进封装• 陶瓷• 芯片附着• 板上芯片（COB）• 芯片级封装• 弹性基板• 微机电系统（MEMS）• 微电路技术• 微电子材料• 多芯片模块（MCMs）• 有机/聚合物电子• 印刷电子• 半导体技术• 固态传感器• 热管理• 厚/薄膜技术• 晶圆级加工。