IEEE Transactions on Components Packaging and Manufacturing Technology

期刊简介：IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

【译文】IEEE Transactions on Components, Packaging, and Manufacturing Technology 发表关于电子、光子及MEMS封装建模、设计、构建模块、技术基础设施和分析的研究和应用文章，以及无源元件、电气接触和连接器、热管理和设备可靠性的新进展；还包括电子部件和组件的制造，涵盖设计、工厂建模、组装方法、质量、产品鲁棒性和面向环境的可设计性。