Materials Science in Semiconductor Processing

期刊简介：Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

【译文】半导体加工中的材料科学提供了一个独特的论坛，用于讨论功能材料和器件（光）电子学、传感器、探测器、生物技术和绿色能源的新加工、应用和理论研究。每一期都将旨在提供当前见解、新成就、突破和未来趋势的快照，涵盖微电子学、能量转换和存储、通信、生物技术、（光）催化、纳米和薄膜技术、混合和复合材料、化学加工、气相沉积、器件制造和建模等多样化领域，这些是先进半导体加工和应用的基础。涵盖内容包括：亚微米器件的高级光刻；蚀刻及相关主题；离子注入；损伤演变及相关问题；等离子体和热CVD；快速热处理；先进的金属化和互连方案；薄介电层、氧化；溶胶-凝胶处理；化学浴和（电）化学沉积；化合物半导体加工；新型非氧化物材料和其应用；（宏）分子和混合材料；分子动力学、从头计算方法、蒙特卡洛等；离散和集成电路的新材料和工艺；磁性材料和自旋电子学；异质结构和量子器件；半导体电学和光学特性的工程；晶体生长机制；可靠性、缺陷密度、固有杂质和缺陷。