Journal of Electronic Packaging

期刊简介：The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.

【译文】《电子封装杂志》发表使用实验和理论（分析和计算机辅助）方法、方法和技术的论文，以解决在分析、设计、制造、测试和操作电子和光电子组件、设备和系统过程中遇到的机械、材料和可靠性问题。范围：微系统封装；系统集成；柔性电子；具有纳米结构的材料和一般小型系统。