Soldering and Surface Mount Technology

期刊简介：Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.

【译文】焊接与表面贴装技术致力于为该领域的技术知识和专业技能的发展做出重要贡献。该期刊与姐妹出版物《电路世界》和《国际微电子学》相辅相成。期刊涵盖了SMT的所有方面，从合金、膏体和助焊剂到可靠性和环境影响，目前正为无铅焊料和工艺的新知识提供重要的传播途径。该期刊对用于组装最先进功能电子设备的关键材料和技术的多学科研究进行了探讨。主要关注通过焊接组装设备和互连组件，同时涵盖了一系列相关方法。