Journal of Microelectronics and Electronic Packaging

期刊简介：Presents papers in hybrid microelectronics, multichip modules, packaging, electronic materials, surface-mount and other related technologies, interconnections, manufacturing, design, test and reliability.

【译文】发表混合微电子、多芯片模块、封装、电子材料、表面贴装和其他相关技术、互连、制造、设计、测试和可靠性方面的论文。