High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes

译名:高温材料过程期刊

HIGH TEMPERATURE MATERIAL PROCESSES

EIESCIJCR Q4

<1

2026

影响因子区间

平台估算

投稿周期

6%

2025

中国作者发文占比

40000000 IRR;600 USD

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期刊简介:High Temperature Material Processes is an important international publication devoted to original and invited review papers on fundamental and applied re-search and new developments in materials processing and synthesis at high temperatures, especially under the plasma action as well as the treatment by laser, ion and electron beams. Processes of interest include (but not limited to) surface treatments, alloying, coatings production, nanostructures synthesis, welding, cutting, melting, re-melting and purification of metals, metallurgy (among them plasma metallurgy), powder densification, ultra-fine powder production, waste conversion and destruction. In addition, attention is paid to the development, description and study of experimental and industrial systems and devices for the implementation of high-technology plasma and beam processes. Thus, there is a broad range of coverage of experimental, analytical and numerical studies. High Temperature Material Processes will serve the needs of those who develop high temperature processes to produce materials with improved properties, surface treatments or coatings with given specifications, and will also promote connections between laboratories and industry.

【译文】《高温材料工艺》是一本重要的国际出版物,专注于高温材料加工和合成的基础和应用研究以及新发展的原创和特邀综述论文,特别是在等离子体作用以及激光、离子和电子束处理下。感兴趣的工艺包括但不限于表面处理、合金化、涂层生产、纳米结构合成、焊接、切割、熔化、再熔化和金属的提纯。此外,还关注实验和工业系统及设备的发展、描述和研究,以实施高科技等离子体和束工艺。因此,涵盖了广泛的实验、分析和数值研究。该期刊将满足那些开发高温工艺以生产具有改进性能的材料、具有特定规格的表面处理或涂层的人的需求,并将促进实验室与工业之间的联系。

出版社
Begell House
语言
English
学科
地球科学 / 经济学 / 化学 / 综合性期刊 / 管理学 / 物理与天体物理 / 材料科学 / 生物学 / 艺术学 / 医学 / 计算机科学 / 环境科学与生态学 / 工程技术 / 农林科学 / 数学
ISSN
1093-3611
eISSN
1940-4360
出版频率
季刊
创刊年份
1981
投稿网址
http://www.submission.begellhouse.com/
最近更新
2026-04-02 18:16:40
High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes

指标当前值近三年趋势
JCR分区Q4
暂无
影响因子区间<1
暂无